Hardware2026.04.25LandMark Optoelectronics Scales Strategic Capex for 6-inch SiPh Amid Surging Demand and Semiconductor-Grade Transitions
Hardware2026.04.25NEO Semiconductor Validates 3D X-DRAM PoC as Cost-Effective HBM Alternative Using 3D NAND Processes
Hardware2026.04.25Princeton Researchers Unveil 3D Bioelectronic Mesh for Biological Computing and Neural Efficiency Analysis
Hardware2026.04.25Denso Withdraws Bid for Rohm: A Strategic Shift in Toyota's Semiconductor Supply Chain
Hardware2026.04.25SoftBank’s Strategic Pivot: Repurposing Sharp LCD Assets for AI Infrastructure Energy Independence
Hardware2026.04.25Apple’s Ternus Era Begins as Elon Musk Eyes $60B Cursor Acquisition Amid AI Developer Hype
Hardware2026.04.25TSMC Advanced Packaging Equipment Reshuffle: Executive Turmoil at Supplier Triggers Market Shift for CoWoS and CoPoS
Hardware2026.04.25Strait of Hormuz Blockade Triggers Photoresist Crisis: Assessing Geopolitical Vulnerabilities in EUV Supply Chains
Hardware2026.04.25TSMC 2nm N2P Node and M31 Partnership: Successful eUSB2V2 IP Tapeout Signals Readiness for 2026 Fabrication Cycle
Hardware2026.04.25Samsung Night-Shift Production Plummets 58% as 40,000 Workers Strike for Bonuses Up to $400,000
Hardware2026.04.24Meta Secures Millions of Amazon Custom CPUs for AI Agentic Workloads: A Strategic Shift Toward Heterogeneous Infrastructure and Silicon Independence
Hardware2026.04.24SMIC’s Strategic Pivot: Scaling Advanced Packaging and Chiplet Ecosystems to Counter Lithography Constraints
Hardware2026.04.24Google Unveils 8th Gen TPU at Cloud Next 2026: Vertical Integration and the Dominance of the Taiwanese ASIC Ecosystem
Hardware2026.04.24AI PCB Supply Bottlenecks: Shift to T-Glass and Rising Energy Costs Pressure Manufacturing Margins
