Insights2026.04.29Microsoft Shader Model 6.10: Direct Access to GPU AI Engines via New Matrix Algebra API in AgilitySDK 1.720
AI2026.04.29China Unveils Lingshen Supercomputer: Record-Breaking 2 Exaflops Performance via 47,000 CPU-Only Architecture
Hardware2026.04.29Nanya Technology Joins Nvidia's Vera Rubin Supply Chain: Strategic Shift to LPDDR and TSMC Packaging Synergy
Markets2026.04.29China AI Accelerator Market 2026: Huawei Forecasted to Claim 50% Share as Shipments Hit 2.12 Million Units
AI2026.04.29Supermicro Scales Modular AI Data Center Infrastructure with Arm-Based Platforms and OCP ORv3
Hardware2026.04.29AGESA Update: EXPO 1.2 Offers Limited CUDIMM Support on Zen 4/5 Due to IMC Bottleneck
Hardware2026.04.29Radiant Opto-Electronics Implements 2-3 Year Delay on CPO Strategy Amid Structural Market Uncertainty
Hardware2026.04.28Recovery: 세계적인 반도체 웨이퍼 제조 장비(WFE) 업체인 도쿄 일렉트론이 최근 발생한 기술 유출 사고로 인해 핵심 파트너인 TSMC와...
AI2026.04.28Canonical’s Sovereign AI for Ubuntu: Reimagining Linux Productivity Without the Copilot Compromise
Insights2026.04.28Hyundai IONIQ 9 Reveal: AWD Performance Calligraphy and the Future of the E-GMP Platform
Insights2026.04.28Microsoft PowerToys 0.99: Advanced Window Management and the Engineering of Productivity
Insights2026.04.28The Sneakernet Resurgence: Why a $15 USB Drive Still Outpaces Gigabit Networking for Massive Data Transfers
Insights2026.04.28Google Expands Pentagon Partnership Following Anthropic’s Refusal of Surveillance AI
