Hardware2026.05.22Lam Research Targets Post-Wafer Era with Salzburg Panel Level Packaging Center of Excellence
Hardware2026.05.21AMD Injects $10B into Taiwan's Semiconductor Cluster to Scale Helios Rack-Scale Platform
Hardware2026.05.18Nan Ya PCB Forecasts Record Capital Spending in 2026 to Support AI-Driven Substrate Demand
Hardware2026.05.17Galatek’s Micron-Level Innovation: Solving Yield Bottlenecks in the Global AI Chip Packaging Race
Hardware2026.05.15Taiwanese Display Giants Pivot to FOPLP and CPO: Leveraging Glass Substrates for Next-Gen AI Interconnects
Hardware2026.05.15Nan Ya PCB Amplifies High-End IC Substrate Capacity to Mitigate Global AI Hardware Bottlenecks
Hardware2026.05.15TSMC AI Infrastructure Hegemony: 18 New Fabs and the Global Expansion of CoWoS and SoIC Packaging Capacity
Hardware2026.05.14MediaTek Adopts Intel EMIB Alongside TSMC CoWoS: A Masterstroke in Foundry-Neutral Advanced Packaging
Hardware2026.05.14Samsung’s Critical Pivot: Shifting Focus from HBM to 3D NAND and Glass Substrate Hegemony
Hardware2026.05.14Bridging the Back-end Gap: South Korea’s Struggle in the AI Server Packaging Market
Hardware2026.05.13Ableprint Achieves Record 82.1% Q1 Profit Growth as Co-Packaged Optics (CPO) Enters Commercial Production Phase
Hardware2026.05.132026 ASIC Sector Divergence: GUC Surges on AI Momentum While Faraday and Alchip Navigate Transition Hurdles
Hardware2026.05.11The Technical Pivot: Why SK hynix is Integrating Intel’s EMIB 2.5D Packaging for Next-Gen HBM
Hardware2026.05.11ASE and Wus Printed Circuit Form Strategic Alliance for Kaohsiung Advanced Packaging Facility to Shore Up AI Capacity by 2029
Hardware2026.05.09TSMC Targets Advanced Packaging Dominance via Exclusive CoPoS Supply Chain Controls