Hardware2026.05.14Bridging the Back-end Gap: South Korea’s Struggle in the AI Server Packaging Market
Hardware2026.05.11The Technical Pivot: Why SK hynix is Integrating Intel’s EMIB 2.5D Packaging for Next-Gen HBM
Hardware2026.05.11Market Surge: SK hynix and Intel Forge 2.5D Packaging Alliance to Advance HBM Integration
Hardware2026.05.09SK hynix Memory Capacity Hits Zero: Desperate AI Clients Directly Subsidize Infrastructure and EUV Procurement
Markets2026.05.08Baidu Spins Off Kunlun Chip Unit: XPU Architecture Autonomy and Dual-Listing Strategy
Hardware2026.05.08Customer-Funded Fabs: Big Tech's Strategic CAPEX Injection into SK Hynix for HBM and EUV Seniority
Hardware2026.05.03South Korea’s AI Chip Sector Hits Historic Export Highs Amid Tightening Supply Chains and Geopolitical Friction
Hardware2026.05.01Samsung and SK Hynix Project HBM Shortages Through 2027; Record Profits Imminent as AI Demand Cannibalizes General DRAM Capacity
Hardware2026.04.30Advantest and Hitachi: The Silent Architects of the Global Generative AI Profit Bonanza